doc. no : qw0905- rev. : date : 23 - apr. - 2007 a LPG2041-PF data sheet ligitek electronics co.,ltd. property of ligitek only round type led lamps LPG2041-PF pb lead-free parts
25.0min directivity radiation note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. 50% 100%50% 75% 0 25%25% -60 100% 75% 60 30 0 -30 2.54typ 1.0min + - 0.5 typ part no. package dimensions 1/5 page LPG2041-PF 4.2 5.2 1.5max 4.0 3.0 ligitek electronics co.,ltd. property of ligitek only
note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. absolute maximum ratings at ta=25 i fp pd i f tstg t opr symbol typical electrical & optical characteristics (ta=25 ) power dissipation reverse current @5v storage temperature operating temperature parameter peak forward current duty 1/10@10khz forward current 100 -40 ~ +100 -40 ~ +85 ir 10 ratings pg 120 30 mw a ma ma unit ligitek electronics co.,ltd. property of ligitek only page 2/5 30 viewing angle 2 1/2 (deg) min. 8.0 20 min. 1.7 forward voltage @ ma(v) max. 2.6 peak wave length pnm 555 spectral halfwidth nm 30 typ. luminous intensity @10ma(mcd) 20 emitted green part no LPG2041-PF material gap lens color green transparent LPG2041-PF part no.
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 pg chip fig.6 directive radiation 4.0 page3/5 LPG2041-PF part no.
0 preheat 0 25 2 /sec max 100 50 150 time(sec) temp( c) 120 260 5 /sec max 260 c3sec max dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) ligitek electronics co.,ltd. property of ligitek only page 4/5 60 seconds max note:1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. LPG2041-PF part no.
reference standard mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 page 5/5 test itemtest condition reliability test: high temperature storage test 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) low temperature storage test 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) operating life test ligitek electronics co.,ltd. property of ligitek only description the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. mil-std-202:103b jis c 7021: b-11 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 high temperature high humidity test 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs thermal shock test solder resistance test 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles solderability test 1.t.sol=230 5 2.dwell time=5 1sec the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this test is the resistance of the device under tropical for hours. this test intended to see soldering well performed or not. LPG2041-PF part no.
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